Prevention of Running Blots between the Patterns during the Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finish
نویسندگان
چکیده
منابع مشابه
Electroless Nickel / Electroless Palladium / Immersion Gold Process For Multi-Purpose Assembly Technology
As the second part to a paper presented at the 2004 SMTA Pan Pacific Symposium, this paper further summarizes the results from technical qualification of the Ni/Pd/Au process. Whereas the previous paper examined the wire bonding capabilities of this surface finish, this second paper focuses specific attention to BGA applications. In these investigations, the solder joint integrity is measured u...
متن کاملThe Benefits of Enepig with Pure Pd for Gold Wire Bonding
As a surface finish, electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold thickness compared to conventional electroless nickel / immersion gold (ENIG) the ENEPIG finish offers the potential for higher reliability, better performance and reduced cost.[1,2] This paper shows th...
متن کاملThe surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition
This paper discusses on the surface characteristics of each of the seven set-up process steps prior completion of under bump metallurgy (UBM) deposition. The Atomic Force Microscopy (AFM) and Scanning Electron Microscopy (SEM) techniques were used to obtain the surface roughness and morphology of each deposition process. The elemental analysis using Energy Disperse X-Ray (EDX) and precision mic...
متن کاملThe Electrochemical Effects of Immersion Gold on Electroless Nickel with Conclusions Oct 10th 2009
We have analyzed the effects of immersion gold (i-Au) and electroless nickel (e-Ni) thickness, on the reliability of a semiconductor device which has special constraints on the absolute Ni and Au layer thickness. The electrochemical reactions involved in the deposition of immersion Au over Ni involves a substitution process by which Ni atoms are replaced by Au atoms. We demonstrate that in some...
متن کاملEffect of ENEPIG Surface Finish on the Vibration Reliability of Solder Interconnects
Surface finishes are used to preserve and promote solderability of exposed copper metallization on printed wiring boards. While in the best of worlds, the solder used in assembly should dictate the solder interconnect reliability, surface finishes are known to have an effect. The effect of surface finishes on solder interconnect reliability can be particularly strong under high strain rate load...
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ژورنال
عنوان ژورنال: Clean Technology
سال: 2013
ISSN: 1598-9712
DOI: 10.7464/ksct.2013.19.2.084